Conductive Highly Filled Suspensions for an Electrochemical Dispensing Approach to Pattern Full-Area Thin Metal Layers by Physical Vapour Deposition.
Sci Rep. 2020 May 04;10(1):7409
Authors: Gensowski K, Tepner S, Schweigert S, Clement F, Kamp M, Pospischil M, Bartsch J
